Rogers PCB refers to printed circuit boards built with Rogers high-performance laminates (instead of conventional FR-4), designed for:

  • High-frequency / microwave circuits

  • High-speed and low-jitter digital transmission

  • High-reliability electronics that face thermal cycling, humidity, or harsh environments

Common Rogers Material Options

We can manufacture Rogers PCBs using commonly selected Rogers material families such as:

  • RO4000 Series: Glass-fiber reinforced, strong cost-performance for commercial high-frequency PCBs

  • RO3000 Series: Ceramic-filled, very low loss for millimeter-wave applications

  • RT/duroid Series: PTFE-based ultra-low loss substrates for advanced RF designs

  • TMM Series: High thermal conductivity + low loss + high thermal stability, built for high-performance needs

(Final selection depends on frequency band, loss target, stackup, and fabrication constraints.

 

 

Key Advantages

1) Excellent Electrical Performance

  • Stable Dielectric Constant (Dk): Minimal Dk variation across frequency and temperature helps maintain impedance and phase stability, especially in RF and high-frequency circuits.

  • Extremely Low Dielectric Loss (Df): Lower loss than FR-4 reduces signal attenuation and improves high-frequency signal integrity, particularly in higher GHz ranges.

  • Low Surface Roughness Options: Smoother copper foil surfaces help reduce conductor loss caused by skin effect, which becomes more important at millimeter-wave frequencies.

2) Thermal Stability & Reliability

  • Low CTE (Coefficient of Thermal Expansion): Better CTE matching (especially with copper) reduces risk of via / hole wall stress during temperature cycling—important for multilayer reliability.

  • High Tg Options: Some Rogers materials support high-temperature processing (including lead-free assembly conditions).

  • High Temperature & Chemical Resistance: Suitable for demanding environments such as automotive electronics and aerospace-related designs.

3) Mechanical Properties & Process Adaptability

  • High Dimensional Stability: Low moisture absorption improves stability under humidity and helps reduce deformation during processing and soldering.

  • Process Compatibility: Rogers materials can be used in hybrid stackups with FR-4 to balance performance and cost (common for RF + control mixed designs).